UV LASER MARKING MACHINE
Equipment advantages:
Suitable for high-end market for ultra-fine processing, such as mobile phones, chargers, data cables, pharmaceutical packages, cosmetics packages, and polymer materials surface marking. Also it can be used for marking of flexible PCB boards, dicing; micro-holes and blind holes for silicon wafers, LCDQA code marking, glassware punching, metal surface marking, plastic buttons, electronic components, gifts, communication equipment, building materials marking, etc.
Model | CX-03Z/08Z/10Z |
Process area | 100*100mm |
Laser power | 3W/8W/10W optional |
Laser wavelength | 355nm |
Laser type | 808nm semiconductor pumping source |
Lens | Laser lens imported from US |
Cooling type | Professional industrial thermostat system |
Marking speed | 500 characters/sec |
Laser energy control | 0-100% software setting |
Minimum font | 0.1mm |
Minimum mark line-width | 0.01mm |
Repeat positioning accuracy | ±0.001mm |
Whole power | 1.5KW |
Power supply | AC 110V/220V ±10%,50HZ/60HZ |
Working environment | Temperature:1-45°C, Hum1d1ty:5-95% |
Dimensions | 900*1000*1600mm |
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